C - Chemistry – Metallurgy – 25 – C
Patent
C - Chemistry, Metallurgy
25
C
204/7
C25C 5/02 (2006.01)
Patent
CA 1046974
PATENT APPLICATION of RALPH E. RIPPERE for ELECTROLYTIC METHODS FOR PRODUCTION OF HIGH DENSITY COPPER POWDER ABSTRACT OF THE DISCLOSURE Electrolytic methods for making high density copper powder starting with copper powder of lower apparent density are disclosed. Copper powder of lower apparent density is used as a cathode for the formation of copper powder having a desired relatively high apparent density. According to one embodiment, an integral two-phase process is provided in which copper powder of relatively lower apparent density is formed by electrodeposition, and the powder so-formed is then used in a second phase electrodeposition process as a cathode on which copper powder of the desired relatively high apparent density is formed.
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