C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 11/36 (2006.01)
Patent
CA 2320865
The present invention provides a phosphate chemical treatment technology suitable for electrolytic treatment. The present invention discloses a phosphate chemical treatment bath containing at least phosphate ions and phosphoric acid, nitrate ions, metal ions that form a complex with phosphate ions in the phosphate chemical treatment bath, and metal ions for which the electrical potential, at which the ions of the metal dissolved in the phosphate chemical treatment bath are reduced and precipitate as metal, is equal to or greater than the anodic electrolytic reaction potential of water as the solvent; the concentration of metal ions other than those which are a component of the film in the treatment bath being 0-400 ppm, and the treatment bath being substantially free of solids that have an effect on the film formation reaction.
Cette invention se rapporte à un procédé de phosphatation convenant à un traitement électrolytique, qui utilise un bain de phosphatation contenant un ion phosphate et de l'acide phosphorique, de l'acide nitrique, un ion métallique capable de former un complexe avec le ion phosphate dans le bain de phosphatation et un ion métallique ayant un potentiel électrique auquel l'ion métallique dissous dans le bain de phosphatation est réduit et se dépose sous la forme de métal d'une valeur identique ou supérieure à celle de la réaction par électrolyse anodique de l'eau, ainsi qu'au solvant utilisé dans ce bain. Ce bain contient un ion métallique autre qu'un constituant du revêtement devant être formé selon une quantité comprise entre 0 et 400 ppm et ce bain est sensiblement exempt de particules solides pouvant affecter la réaction de formation du film de revêtement.
Matsuda Shigeki
Nishiya Shin
Borden Ladner Gervais Llp
Denso Corporation
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