Electrolytic plating method and apparatus for discrete...

Details Electrolytic plating method and apparatus for discrete... Electrolytic plating method and apparatus for discrete...

C - Chemistry, Metallurgy

25

D

204/11, 204/122

C25D 5/00 (2006.01) C25D 5/08 (2006.01) C25D 17/00 (2006.01) C25D 21/10 (2006.01)

Patent

CA 1071568

Abstract of the Disclosure Method and apparatus are disclosed for electrolytically producing very uniform coatings of a desired material in dis- crete microsized particles. Agglomeration of bridging of the particles during the deposition process is prevented by impart- ing a sufficiently random motion to the particles that they are not in contact with a powered cathode for a time sufficient for such to occur.

258913

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