Electronic assembly with improved grounding and emi shielding

Details Electronic assembly with improved grounding and emi shielding Electronic assembly with improved grounding and emi shielding

H - Electricity

05

K

H05K 9/00 (2006.01) H01R 13/658 (2006.01)

Patent

CA 2114325

An electronic assembly (2) includes an electronic module (8) mountable to a backplane (4) having a ground plane (48) for grounding and EMI shielding. The module includes a conductive chassis (10) having a floating chassis board (12). Connector (18) is mounted to the chassis board and mates with connectors (20) mounted on the backplane when the module engages the backplane. Grounding clip (24) mounted to the chassis board engages an align- ment pin (42) extending from the backplane and includes a laterally extending resilient arm (30) which grounds the clip to the chassis. The grounding clip is electrically connected to the chassis board ground plane (22) so that both ground planes are grounded to the chassis through the grounding clip. The backplane includes a ground pad (50) which circumscribes the connectors and is connect- ed to the ground plane. Conductive gasket (54) mechanically and electrically couples the chassis with the ground pad.

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