Electronic circuit board

H - Electricity – 05 – K

Patent

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Details

H05K 7/14 (2006.01) G06F 1/18 (2006.01) G06F 1/20 (2006.01) G06F 13/40 (2006.01) H05K 9/00 (2006.01)

Patent

CA 2350135

An electronic circuit board assembly and method that enable close stacking and cooling of pluralities of similar electronic I/O or memory boards (C1, C1' C2, C2') provided with powering terminals (E, E1) and requiring high speed communication comprising an upper and a lower set of boards in a frame, an intermediate space (S, S1), powering terminals (E, E1) and terminals (T, T1) for connection with a switching fabric board (D), power backing planes (P, P1) switching fabric boards (D) centrally mounted between the groups (C1, C1', C2, C2'), and with a backing plane (F) therefor extending intermediately of the frame between the upper and lower section backing plates (P, P') and is isolatively separate therefrom to provide a no-power quiescent zone for the switching fabric (or CPU) boards.

L'invention porte sur système de montage de cartes de circuits électroniques et le procédé associé permettant un regroupement à forte densité, et le refroidissement, de plusieurs cartes E/S ou mémoire (C¿1?, C¿1?', C¿2?, C¿2?'), muni de bornes d'alimentation (E, E?1¿) et capable d'assurer des communications à grande vitesse. Ledit ensemble comprend un groupe supérieur et un groupe inférieur de cartes, placés dans un châssis, un espace intermédiaire (S, S?1¿), des bornes d'alimentation (E, E?1¿), des bornes (T, T?1¿) pour le branchement d'une carte (D) d'interconnexion, des plans arrière d'alimentation (P, P?1¿), une carte (D) d'interconnexion montée en position intermédiaire entre les groupes (C¿1?, C¿1?', C¿2?, C¿2?') et un plan arrière (F) s'étendant entre la section supérieure et la section inférieure du châssis et en étant isolé de manière à créer une zone de repos sans courant pour les cartes d'interconnexion ou les cartes unités centrales.

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