Electronic circuit comprising conductive bridges and method...

H - Electricity – 05 – K

Patent

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Details

H05K 3/40 (2006.01) G06K 19/077 (2006.01) H01L 21/48 (2006.01) H01L 23/498 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2462252

The aim of this invention is to obtain a very cheap electronic circuit used for example in a card or a label while maintaining high reliability. It particularly concerns the connection of one or several electronic components on the conductive tracks by means of conductive bridges that traverse the substrate. The electronic circuit according to the invention includes at least one electronic component (6), a substrate (5), on a first face of this substrate an adhesive layer and a conductive layer including a plurality of tracks (4) are applied. The electronic component (6) comprises at least two connection areas (7). One of these connection areas (7) is electrically linked to the conductive layer by a conductive bridge formed by a conductive segment (1) delimited in the conductive layer only. Said segment (1), free from any adhesive substance, traverses the substrate (5) through a passage (2, 3) and links the connection area (7).

Le but de la présente invention est d'obtenir un circuit électronique utilisé par exemple dans une carte ou une étiquette très bon marché tout en conservant une fiabilité élevée. Ceci concerne en particulier la connexion d'un ou des composants électroniques sur les pistes conductrices au moyen de ponts conducteurs qui traversent le substrat.Le circuit électronique selon l'invention comprend au moins un composant électronique (6), un substrat (5), sur une première face de ce substrat est appliqué une couche adhésive et une couche conductrice constituée par une pluralité de pistes (4). Le composant électronique (6) comporte au moins deux plages de connexion (7). Une de ces plages (7) est reliée électriquement ô la couche conductrice par un pont conducteur formé par un segment conducteur (1) délimité dans la couche conductrice seule. Ce segment (1), dépourvu de substance adhésive, traverse le substrat (5) au moyen d'un passage (2, 3) et relie la plage de connexion (7).

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