Electronic circuit device and method of fabricating the same

Details Electronic circuit device and method of fabricating the same Electronic circuit device and method of fabricating the same

H - Electricity

01

L

H01L 23/34 (2006.01) H01L 23/14 (2006.01) H01L 23/367 (2006.01) H01L 23/42 (2006.01) H01L 25/07 (2006.01) H05K 5/00 (2006.01) H05K 7/20 (2006.01)

Patent

CA 2273474

An electronic circuit device having an improved heat dissipating effect, a small size and a high reliability is provided with a metal substrate having a first surface and a second surface and a case. Electronic parts are mounted on only the first surface and the case is united with a radiating fin in one body. The metal substrate is installed in the case such that the metal substrate serves as a cap of the case and the first surface of the metal substrate faces to the case. A resin is provided to fill up a space between the metal substrate and the case, whereby heat generated from the electronic parts is dissipated to the exterior from both the radiating fin and the second surface of the metal substrate.

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