H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 7/20 (2006.01) H01L 23/373 (2006.01) H01L 23/495 (2006.01)
Patent
CA 2258438
An electronic circuit device package of the type having a metal laminate base flange of molybdenum clad with copper on both faces has a CVD diamond film substrate inlaid in a well in the bottom of the base flange so that it is flush with the base flange surface. An opening in the opposite side of the base flange forms a chamber with the diamond as a floor to which the device may be bonded in intimate contact with the diamond substrate. The edges of the diamond are brazedwith a gold-indium braze in intimate thermal contact with a shoulder of the well to maximize heat conduction from the edges of the diamond into the base flange. Thebase flange may be fastened to the flat surface of a heat sink member with the diamond in intimate thermal contact with the heat sink member.
Gowling Lafleur Henderson Llp
Saint-Gobain Industrial Ceramics Inc.
LandOfFree
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