H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/42 (2006.01) H01L 21/48 (2006.01) H01L 23/373 (2006.01)
Patent
CA 2066125
The use of a conductive reactive braze material, loaded in via holes of a diamond substrate and heated in a suitable temperature range, results in conductive vias with excellent adherence to the via hole in the diamond material. Cracking of the diamond substrate, and loose or lost via elements, are minimized. A form of the disclosure is directed to a method for producing a circuit board having a multiplicity of conductive vias. A generally planar diamond substrate is provided. A multiplicity of via holes are formed through the substrate. The holes are loaded with a conductive reactive braze material. The braze material and the substrate are heated to a temperature which causes the braze material to melt and to react with the inner surface of the via holes and bond thereto. In an illustrated embodiment, the braze material comprises a conductive matrix component that includes at least one element selected from the group consisting of copper, silver, and gold, and a reactive component that includes at least one element selected from the group consisting of titanium, chromium, vanadium, zirconium, and hafnium. Another form of the disclosure is directed to a circuit board in which conductive vias pass through a diamond substrate and form a compound with the substrate at the inner surface of the via holes to bond to said inner surface of the via holes.
Gowling Lafleur Henderson Llp
Norton Company
LandOfFree
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