Electronic component

Details Electronic component Electronic component

H - Electricity

01

L

H01L 41/053 (2006.01) H04R 17/00 (2006.01) H05K 1/18 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01) H05K 1/14 (2006.01)

Patent

CA 2143293

An electronic element A1 has a lead electrode at the edge and a supporting member A2, positioned so that it faces the electronic element across a gap G. The supporting member A2 also has an external connecting terminal A5 at a location opposite the lead electrode A4. A resin layer A3 is positioned between electronic element A1 and supporting member A2, indented by the distance d from the edge of the electronic element A1. The resin layer bonds the electronic element (A1) and supporting member A2. The relationship of the distance d with G should satisfy this expression; d > G. A solder A6 fills the space created by the gap G between the lead electrode A4 and the external connecting terminal A5 over the distance d which is the distance from the edge of the electronic component A1, to the resin layer A3. The solder connects the lead electrode A4 and the external connecting terminal A5. No defective connection occurs between the lead electrode and the external connecting terminal when the electronic component is mounted on the printed board.

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