Electronic component

H - Electricity – 03 – H

Patent

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Details

H03H 3/08 (2006.01) H03H 9/05 (2006.01) H03H 9/10 (2006.01)

Patent

CA 2330039

The invention relates to a surface wave component and to a method for the production of the same, comprising a chip (2) with a piezoelectric substrate, electronic conductive structures arranged on said chip (IDT converters, contact strips and the like), a base plate (3) with external contact elements contacting the electric conductive structures of the chip and a hermetically sealed frame (4) mounted on the base plate, the chip being arranged inside and at a distance from said frame. The area between the chip (2) and the base plate (3) is sealed off with a foil (5), the area between the frame (4) and the foil (5) is filled with a sealing compound (6) and the chip (2) along with the sealing compound (6) and the frame (4) are protected by a cover (7) or a protective cap made of galvanic material, the edges (8) of which rest on the base plate (3) hermetically sealing the latter.

L'invention concerne un composant à ondes superficielles ainsi que son procédé de fabrication, ledit composant comprenant une puce (2) présentant un substrat piézoélectrique, des structures électroniquement conductrices agencées sur la puce (convertisseurs IDT, pistes de connexion et analogues), des éléments de connexion externes en contact avec les structures électriquement conductrices de la puce, et un cadre étanche (4), agencé hermétiquement sur la plaque de base, à l'intérieur duquel la puce est logée, à distance de ce cadre. L'invention est caractérisée en ce que l'espace entre la puce (2) et la plaque de base (3) est entouré de façon étanche par une feuille (5), l'espace entre le cadre (4) et la feuille (5) est rempli d'une masse de scellement (6), et la puce (2) ainsi que la masse de scellement (6) et le cadre (4) sont protégés par un revêtement (7) ou une coiffe de protection en une matière galvanique s'appliquant hermétiquement, par sa bordure (8), sur la plaque de base (3).

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