Electronic component, especially one operating with acoustic...

H - Electricity – 03 – H

Patent

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Details

H03H 9/64 (2006.01) H03H 9/05 (2006.01) H03H 9/10 (2006.01)

Patent

CA 2241132

An SW component with a component system (1-3) mounted by the flip-chip technique onto a printed circuit board (5) and with a frame (4) surrounding the component structures (1-3), in which conductive tracks (6, 8) are interconnected on the printed circuit board (5) by this through connection (9- 1, 9-2, 9-3) in such a way that components (9-1, 9-2) running in the direction of their extension are mutually staggered and interconnected via a connecting member (9-3).

L'invention concerne un composant à ondes de surface comportant un système de composants (1-3) monté par bosses soudées sur une carte de circuits (5) et un cadre (4) entourant les structures de composant (1-3). Des tracés conducteurs (6, 8) sont interconnectés sur la carte de circuits (5) par une connexion transversale (9-1, 9-2, 9-3) qui la traverse, de manière que des parties (9-1, 9-2) s'étendant dans le sens de la connexion transversale soient décalées les unes par rapport aux autres et soient interconnectées par une pièce de raccordement (9-3).

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