Electronic component, in particular an saw component...

H - Electricity – 03 – H

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H03H 9/64 (2006.01) H03H 9/05 (2006.01) H03H 9/10 (2006.01)

Patent

CA 2241147

An SW component with electrical structures (3) sealed against environmental influences by a cap-like cover (2), in which there are metallised points (4) in windows (7) in the cover (2) of bonding pads of the electrically conductive structures (3) therein and solderable metallised points (6) on the cover (2), which are connected to the PAD metallised points (4) via through connections (5).

L'invention concerne un composant à ondes de surface, mis à l'abri de l'influence des conditions ambiantes par des structures électriques encapsulées (3) au moyen d'un élément de protection (2) se présentant sous forme de capot. Dans des fenêtres (7) pratiquées dans l'élément de protection (2), il est prévu des métallisations (4) des plages de connexion des structures électroconductrices (3) se trouvant à l'intérieur, ainsi que des métallisations (6) brasables, sur l'élément de protection (2). Ces métallisations (6) sont connectées aux métallisations (4) des plages de connexion par l'intermédiaire de connexions transversales (5).

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Electronic component, in particular an saw component... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic component, in particular an saw component..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic component, in particular an saw component... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1836025

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.