Electronic component module

Details Electronic component module Electronic component module

H - Electricity

01

L

H01L 25/065 (2006.01) H01L 25/07 (2006.01)

Patent

CA 2650547

The invention relates to an electronic component module, comprising at least one first multi-layer circuit board module (21, 22; 31, 32; 41, 42) and a cooling arrangement (23, 33, 43), the cooling arrangement (23, 33, 43) being in contact with an upper side of the circuit board module (21, 22; 31, 32; 41, 42). The cooling arrangement (23, 33, 43) is designed such that waste heat generated during operation of the electronic component module (2, 3, 4) is extracted in a lateral direction with relation to the arrangement of the circuit board module (21,22; 31, 32; 41, 42) by means of the cooling arrangement (23, 33, 43).

Module composant électronique comprenant au moins un premier ensemble de supports de circuits multicouches (21, 22; 31, 32; 41, 42) et un dispositif de refroidissement (23,33,43) qui est en contact avec une face supérieure de l'ensemble de supports de circuits multicouches (21, 22; 31, 32; 41, 42). Le dispositif de refroidissement (23,33,43) est conçu de telle sorte que la chaleur produite lors du fonctionnement du module composant électronique (2, 3, 4) est évacuée dans le sens latéral relativement à la disposition de l'ensemble de supports de circuits multicouches (21, 22; 31, 32; 41, 42) par le dispositif de refroidissement (23,33,43).

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