Electronic component package comprising a moisture retention...

Details Electronic component package comprising a moisture retention... Electronic component package comprising a moisture retention...

H - Electricity

01

L

356/111, 356/21,

H01L 23/02 (2006.01)

Patent

CA 1217570

AN ELECTRONIC COMPONENT PACKAGE COMPRISING A MOISTURE-RETENTION ELEMENT ABSTRACT OF THE DISCLOSURE A hermetically sealed encapsulation package for electronic components and integrated or hybrid electronic circuits comprises a base on which a component is mounted in the conventional manner and a cover. In one embodiment, the base carries an element consisting of a layer of material which is capable of retaining any water molecules which remain within the package after sealing or which may result from in-leakage from the surrounding atmosphere.

444524

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