H - Electricity – 03 – H
Patent
H - Electricity
03
H
H03H 9/05 (2006.01)
Patent
CA 2320907
The invention relates to an OFW component working with acoustic surface waves. Said component comprises a chip (1), a piezoelectric substrate (1a), electrically conductive structures (2, 3, 4) arranged on the substrate and a base plate (15) with external electrical connections lines which are in contact with the electrical conductive structures of the chip (1). A protective film (5, 6) is applied on the surface of the chip supporting the electrically conductive structures (2, 3, 4), which has electrical contact elements (7, 11) on the surface opposite to their piezoelectric substrate (1a). Said elements are connected directly to the structures (2, 3, 4) of the chip (1) by through contacts (8) in the protective film (5, 6) and/or through bumps (10) and to the electrical connection elements of the base plate (15) using SMT technology.
L'invention concerne un composant à ondes de surface, fonctionnant avec des ondes de surface acoustiques, qui comprend une puce (1), un substrat (1a) piézo-électrique et des structures (2, 3, 4) électroconductrices disposées sur le substrat, ainsi qu'une plaque de base (15) avec des éléments de connexion électriques extérieurs qui sont mis en contact avec les structures électroconductrices de la puce (1). Il est prévu sur la surface de la puce portant les structures (2, 3, 4) électroconductrices, une pellicule protectrice (5, 6) qui porte des éléments de contact (7, 11) électriques sur sa surface opposée au substrat (1a) piézo-électrique. Lesdits éléments de contact (7, 11) sont connectés aux structures (2, 3, 4) de la puce (1), d'une part par des connexions transversales (8) dans la pellicule protectrice (5, 6) et/ou directement par des bosses (10) et d'autre part aux éléments de connexion électriques de la plaque de base (15) par technologie de montage en surface.
Kruger Hans
Stelzl Alois
Weidner Karl
Wossler Manfred
Epcos Ag
Fetherstonhaugh & Co.
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