Electronic device and method for fabricating the same

Details Electronic device and method for fabricating the same Electronic device and method for fabricating the same

H - Electricity

01

L

H01L 21/768 (2006.01) H01L 21/66 (2006.01) H01L 23/48 (2006.01)

Patent

CA 2249062

A via hole having a bottom is formed in a substrate and then a conductor layer is formed at least over a sidewall of the via hole. Thereafter, the substrate is thinned by removing a portion of the substrate opposite to another portion of the substrate in which the via hole is formed such that the conductor layer is exposed.

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