Electronic device assembly and a manufacturing method of the...

Details Electronic device assembly and a manufacturing method of the... Electronic device assembly and a manufacturing method of the...

H - Electricity

05

K

H05K 1/14 (2006.01) H01L 21/56 (2006.01) H01L 23/495 (2006.01) H05K 3/36 (2006.01) H05K 3/30 (2006.01) H05K 3/32 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2157259

An electronic device assembly includes a large-scale integrated circuit (LSI) chip mounted on a flexible substrate. The flexible substrate is connected to a second substrate via solder. The flexible substrate is also attached to the second substrate via a resin. When the assembly is manufactured, the solder is provided between the substrates. The resin fills an area between the substrates. The solder and the resin are heated simultaneously. The solder melts to electrically connect the substrates. The resin is set to mechanically couple the substrates.

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