Electronic device fabrication on non-conductive polymer...

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B05D 5/12 (2006.01) B05D 3/10 (2006.01) C08J 7/12 (2006.01) H01B 1/12 (2006.01) H01B 5/14 (2006.01) H01C 7/00 (2006.01) H01C 17/00 (2006.01) H01F 5/00 (2006.01) H01L 51/30 (2006.01) H05K 3/10 (2006.01)

Patent

CA 1291905

ABSTRACT OF THE DISCLOSURE A process for fabricating an electronic device on a non-conductive polymer substrate, particularly from the family of polyaniline, comprises applying a covalent doping agent, such as an R+ donor compound, where R is an organic group, e.g., methyl iodide, to a preselected portion of a base-type non-conductive polymer substrate containing carbon-nitrogen linkages, and converting such preselected portion of the polymer substrate to an electrically conductive polymer portion, by covalent linkage of the R groups of such donor compound, to nitrogen atoms of the non-conductive polymer substrate. Electronic devices, such as resistors, capacitors, inductors, printed circuits and the like, can be provided by the invention process, in the form of light-weight polymers containing no metal, and which are stable and wherein the conductive portions are non-diffusing.

558593

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