H - Electricity – 05 – K
Patent
H - Electricity
05
K
347/48
H05K 7/14 (2006.01) H01R 12/24 (2006.01)
Patent
CA 1310737
- 7 - ABSTRACT OF THE DISCLOSURE An electronic device packaging structure, in which a plurality of electronic circuit packages are arrayed on one side of a back panel with their signal input/output terminals projecting out onto the other side of the panel and each connected to one end of one of plural wiring cables. The other ends of the wiring cables are connected to relay connectors, which are fixed to a common frame, constituting a back panel system. A pair of such back panel systems are detachably coupled together via the relay connectors.
589659
Suzuki Takao
Uekido Kouzou
Corporation Nec
Japan Aviation Electronics Industry Limited
Kirby Eades Gale Baker
LandOfFree
Electronic device packaging structure does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electronic device packaging structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device packaging structure will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1325023