Electronic device sealing resin compositions and sealed...

Details Electronic device sealing resin compositions and sealed... Electronic device sealing resin compositions and sealed...

C - Chemistry, Metallurgy

08

L

400/4113

C08L 81/02 (2006.01) C08K 3/00 (2006.01) C08K 5/54 (2006.01) C09K 3/10 (2006.01) H01L 23/06 (2006.01) H01L 23/29 (2006.01)

Patent

CA 2026801

- 25 - ABSTRACT Disclosed herein are electronic device sealing resin compositions containing 100 parts by weight of a thermoplastic resin mixture composed of 25-60 wt.% of a poly(arylene sulfide) and 40-75 wt.% of an inorganic filler; and 1.5-5 parts by weight of an epoxy-modified silicone oil having an epoxy equivalent of 350-1,000 g/eqiv. Also disclosed are electronic devices sealed using such resin compositions.

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