G - Physics – 06 – K
Patent
G - Physics
06
K
G06K 19/077 (2006.01) G06K 19/02 (2006.01)
Patent
CA 2304844
The invention concerns an electronic device with chip comprising film support including a film support with interface and at least a plane conducting interface, and a microcircuit connected to said interface. The invention is characterised in that the film support and the interface have such characteristics that they can be crumpled or folded together without deteriorating. It is further characterised in that it comprises a compensating film (22) arranged on said film support, said compensating film comprising a recess (21, 23) containing said microcircuit (4), its connections (7, 8) and a coating material (13). The invention also concerns a method for making the label.
La présente invention concerne un dispositif électronique à puce comprenant, un film support à interface comportant un film support et au moins une interface conductrice plane disposée sur ledit film support, ainsi qu'un microcircuit connecté à ladite interface. Il se distingue en ce que le film support et l'interface possèdent des propriétés telles qu'ils sont aptes à être froissés ou pliés ensemble sans dégradation. Il se distingue également en ce qu'il comprend un film de compensation (22) disposé sur ledit film support, ledit film de compensation comportant un évidement (21, 23) contenant ledit microcircuit (4), ses connexions (7, 8) et un matériau d'enrobage (13). L'invention concerne également un procédé de fabrication de l'étiquette.
Blanc Rene-Paul
Desoutter Isabelle
Garnier Pierre
Martin Philippe
Gemplus S.c.a.
Robic
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