Electronic devices

Details Electronic devices Electronic devices

H - Electricity

05

K

H05K 7/20 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2081607

24 ELECTRONIC DEVICES Abstract of the Disclosure Electronic device in which the electronic component side of a printed circuit board is placed sufficiently close to one surface of a heat sink that heat transfer will occur from the components into the heat sink. The component side of the board and the respective surface of the heat sink are sealed from ambient atmosphere to prevent dust contacting the components. Because of this, unpackaged chips may be used on the board. The heat sink has fins on another surface and when the fins are located in a vertical air flow passage, connected air may provide for heat extraction without use of fans.

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