Electronic devices having metallurgies containing...

Details Electronic devices having metallurgies containing... Electronic devices having metallurgies containing...

H - Electricity

01

L

H01L 23/495 (2006.01) C23C 18/50 (2006.01) C25D 3/54 (2006.01) H01L 21/288 (2006.01) H01L 21/60 (2006.01) H01L 21/603 (2006.01) H01L 21/768 (2006.01) H01L 23/498 (2006.01) H01L 23/532 (2006.01)

Patent

CA 2089791

Silicon and germanium containing materials are used as a surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These materials are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.

L'invention concerne des matériaux contenant du silicium et du germanium utilisés à la surface de conducteurs dans des dispositifs électroniques. La soudure peut être réalisée sans flux et les fils appliqués par microsoudage à ces surfaces. Ces matériaux servent de revêtement superficiel pour des cadres de montage destinés au conditionnement de puces de circuit imprimé. Ces matériaux peuvent être appliqués par transfert à la surface des conducteurs ou y être déposés par catalyse ou électrolyse.

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