Electronic package and accessory component assembly

Details Electronic package and accessory component assembly Electronic package and accessory component assembly

H - Electricity

05

K

356/11

H05K 1/11 (2006.01) H05K 1/14 (2006.01) H05K 7/10 (2006.01) H01R 31/08 (2006.01) H05K 1/02 (2006.01) H05K 3/36 (2006.01)

Patent

CA 1173174

AM-2 ABSTRACT OF THE DISCLOSURE Common printed circuit board area usage is provided for electronic packages and accessory com- ponents by the provision of an assembly including a receptacle stacking a package and accessory component and having electrical contact elements with fixed por- tions selectively connected to component contacts and other portions for engaging package contacts. In a preferred embodiment, the assembly includes one or more dual-in-line packages (DIP) and the accessory component is a capacitive decoupling assembly.

382051

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