Electronic package having controlled epoxy flow

Details Electronic package having controlled epoxy flow Electronic package having controlled epoxy flow

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 21/48 (2006.01) H01L 23/10 (2006.01) H01L 23/495 (2006.01)

Patent

CA 2140154

There is provided an electronic package assembly having a die attach paddle (20) bonded to the package base (10') by a compliant adhesive (26). A recessed channel (34) formed in the base (10') is partially over- lapped by the die attach paddle (20). During package sealing, excess adhe- sive (26) accumulates in the recessed channel (34), eliminating bridging of the adhesive (26) to the leadframe (16).

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