Electronic package sealed with a dispensable adhesive

Details Electronic package sealed with a dispensable adhesive Electronic package sealed with a dispensable adhesive

H - Electricity

01

L

H01L 23/02 (2006.01) H01L 21/50 (2006.01) H01L 21/52 (2006.01) H01L 21/56 (2006.01) H01L 23/057 (2006.01) H01L 23/10 (2006.01)

Patent

CA 2150569

There is provided a method for the assem- bly of an electronic package (48) utilizing liquid adhesives (30, 46). A first liquid adhesive (30) is dispensed on a base (12) and a leadframe (16) is supported by the liquid adhesive (30). A sec- ond liquid adhesive (46) is dispensed overlying tbe first liquid adhesive (30) and the leadframe (16), and supports a cover (14). The entire as- sembly is then thermally cured. Means to control the flow of the liquid adhesives (52) and to reduce the mutual inductance between leads (72) are also provided.

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