Electronic package with heat spreader member

Details Electronic package with heat spreader member Electronic package with heat spreader member

H - Electricity

01

L

356/110

H01L 23/36 (2006.01) H01L 23/367 (2006.01) H01L 23/373 (2006.01) H01L 23/433 (2006.01)

Patent

CA 1287929

ABSTRACT An electronic package (10) including a first circuitized substrate 11 (e.g., printed circuit board) having connected thereto a second, flexible circuitized substrate (e.g., polyimide with chrcme-copper-chrome circuitry thereon). The second substrate is in turn electrically connected to the invention's semiconductor device (e.g., silicon chip), which device in turn is attached to a heat spreader (37) for providing effective heat transference from the device to the package's heat sink (33). The heat sink is attached to the first substrate (e.g., using solder). Significantly, the coefficient of thermal expansion of the heat spreader, semiconductor device and adhesive used to connect same are substantially similar in order to provide an effective heat path from the heat-generating device to the corresponding, much larger heat sink.

601600

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