Electronic package with strengthened conductive pad

Details Electronic package with strengthened conductive pad Electronic package with strengthened conductive pad

H - Electricity

01

L

H01L 23/48 (2006.01) H01L 23/498 (2006.01) H05K 1/00 (2006.01) H05K 1/11 (2006.01) H05K 3/34 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2458438

An electronic package and information handling system utilizing same wherein the package substrate includes an internally conductive layer coupled to an external pad and of a size sufficiently large enough to substantially prevent cracking, separation, etc. of the pad when the pad is subjected to a tensile pressure of about 1.4 grams per square mil or greater.

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