H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 5/00 (2006.01) B22F 3/115 (2006.01) B29C 67/00 (2006.01) H01L 21/00 (2006.01) H05K 3/14 (2006.01) H05K 3/46 (2006.01)
Patent
CA 2073787
Abstract of the Disclosure A smart structure or an electronic package is formed by thermal spraying utilizing a plurality of masks positioned and removed over a work surface in accordance with a predetermined sequence. The masks correspond to cross sections normal to a centerline through the structure. Masks are placed above a work surface and sprayed with either at least one primary material to form at least one electronic component and a complementary material. In this manner, layers of material form a block of deposition material and complementary material. Then, the complementary material which serves as a support structure during forming may be removed.
Prinz Fritz B.
Siewiorek Daniel P.
Weiss Lee E.
Prinz Fritz B.
Siewiorek Daniel P.
Smart & Biggar
Weiss Lee E.
LandOfFree
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