Electronic part with heat radiating member

Details Electronic part with heat radiating member Electronic part with heat radiating member

H - Electricity

05

K

356/8

H05K 1/18 (2006.01) H05K 3/30 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2033699

ABSTRACT OF THE DISCLOSURE The structure of an electronic part which may be mounted on and soldered to the surface of a printed circuit board, and a method of mounting such an electronic part. While the electronic part mounted on the circuit board is in operation, heat generated by the part is efficiently radiated to the surroundings. Connecting terminals extending out from the electronic part are firmly soldered to the circuit board by a minimum of heat, whereby the bonding strength and the strength against shocks are enhanced. The electronic part of interest and other electronic parts near it are free from damage ascribable to heat when the former has connecting terminals thereof soldered to the circuit board. When the connecting terminals of the electronic part are soldered to the circuit board by a laser beam, other electronic parts mounted on the circuit board are prevented from being damaged by the laser beam.

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