Electronic parts and method producing the same

Details Electronic parts and method producing the same Electronic parts and method producing the same

H - Electricity

01

B

H01B 1/22 (2006.01) H01F 17/00 (2006.01) H01F 41/04 (2006.01) H01L 49/02 (2006.01) H05K 3/46 (2006.01) H05K 1/03 (2006.01) H05K 1/16 (2006.01) H05K 3/14 (2006.01) H05K 3/16 (2006.01)

Patent

CA 2372757

The invention is to offer electronic parts and a method of producing the same in which a producing time is shortened, crack or warp are hard to occur, and cost-down can be attained. Core substrates are made by forming a resin or a compound material made by mixing powder-like functional materials with this resin into thin plates, and hardening them. Conductor patterns are formed on at least any of front and back surfaces of the core substrates through, any of an evaporation process, an ion plating process, an ion beam process, a sputtering process, and a vapor deposition process, followed by patterning. Half-hardened prepregs are produced by forming the resin or the compound material made by mixing powder-like functional materials with this resin into the thin plates. The prepregs and the cure substrates are alternately laminated and laminated layers are made by unifying through a hot pressing.

Affiliated with

Also associated with

Rating

Electronic parts and method producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic parts and method producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic parts and method producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1594677