H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/03 (2006.01) B23Q 11/10 (2006.01) C03C 25/10 (2006.01) H05K 3/00 (2006.01)
Patent
CA 2400787
The present invention provides an electronic support (210) comprising: (A) a prepeg layer (214) comprising: (1) at least one reinforcement material (220); (2) at least one matrix material (216) in contact with at least a portion of the at least one reinforcement material (220); and (B) at least one layer (217) in contact with at least a portion (224) of at least one surface of the prepeg layer (214), the at least one layer (217) comprising at least one inorganic filler (218) and not greater than 25 weight percent of adhesive materials based on the total weight of at least one layer (217) on a total solids basis.
La présente invention porte sur un support électronique (210) comprenant: (A) une couche préimprégnée (214) comprenant: (1) au moins un matériau de renforcement (220); (2) au moins un matériau matriciel (216) en contact avec au moins une partie du matériau de renforcement (220); et (B) au moins une couche (217) en contact avec au moins une partie (224) d'une surface de la couche préimprégnée (214), cette couche (217) comprenant au moins une charge inorganique (218) et ayant une teneur égale ou inférieure à 25 % en poids de subnstances adhésives par rapport au poids total de la couche (217) sur une base totale en solides.
Lammon-Hilinski Kami
Lawton Ernest L.
Mccarthy Tetrault Llp
Ppg Industries Ohio Inc.
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