Electronic tag assembly and method therefor

Details Electronic tag assembly and method therefor Electronic tag assembly and method therefor

H - Electricity

01

L

H01L 23/52 (2006.01) C09J 5/00 (2006.01) G06K 19/077 (2006.01) G08B 13/24 (2006.01) H01L 21/56 (2006.01) H01L 23/498 (2006.01)

Patent

CA 2364448

An electronic tag assembly (100) includes a substrate (102) having an antenna pattern (140, 106) disposed thereon, an integrated circuit die (108) having electrical interface terminals (204, 206) that directly contact or interface with the antenna l0 pattern (104, 106), and electrically non-conductive adhesive (202) interposed between the substrate and the integrated circuit die (108) that secures both together, and that maintains the integrity of the electrical interface. Preferably, a clamping force is exerted on the integrated circuit die (108) to maintain contact between the electrical terminals (204, 206) and the antenna pattern (104, 106) while the non-conductive adhesive (202) is being introduced.

L'invention concerne un ensemble étiquette électronique (100), comprenant un substrat (102) sur lequel un motif d'antenne (140, 106) est disposé, une puce (108) de circuit intégré pourvue de bornes (204, 206) d'interface électrique en contact direct ou en interface avec ledit motif d'antenne (104, 106), et un adhésif (202) électriquement non conducteur, interposé entre le substrat et la puce de circuit intégré (108), et fixant les deux éléments ensemble, tout en maintenant l'intégrité de l'interface électrique. Une force de serrage s'exerce, de préférence, sur la puce de circuit intégré (108) afin de maintenir le contact entre les bornes électriques (204, 206) et le motif d'antenne (104, 106) pendant que qu'on introduit l'adhésif (202) non conducteur.

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