Electronic thick film component multiple terminal and method...

Details Electronic thick film component multiple terminal and method... Electronic thick film component multiple terminal and method...

H - Electricity

05

K

H05K 3/00 (2006.01) H01F 41/04 (2006.01) H01L 23/498 (2006.01) H05K 3/40 (2006.01) H05K 1/03 (2006.01) H05K 1/09 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2158785

A method of making a plurality of monolithic thick film components (10) having multiple terminals (12, 14, 16, 18) comprising the steps of printing a plurality of components (10) in a wafer form forming a matrix of components, printing holes (20) in the matrix of components where two terminal ends meet thereby separating the terminals (12, 14, 16, 18) on each component, and dipping the terminal ends in a silver based thick film ink (26).

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