H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/00 (2006.01) H01F 17/00 (2006.01) H01F 41/04 (2006.01)
Patent
CA 2158784
A monolithic multilayer chip component (10) comprises a plurality of subassemblies (20, 30, 44, 58) stacked one above the other. At least one of the subassemblies includes a ferrite layer (22) having a conductor (24) printed on its surface. One end (26) of the conductor is exposed adjacent the edge (14) of the chip so that the conductor (24) can be connected to a terminal. A plurality of the chip components are manufactured at the same time by arranging the components on single sheets. The layers including the conductors are arranged such that the ends of the conductor that are adjacent the end of the chip, are adjacent to each other so that when the chips are separated the conductors are cut along with the chip.
Adelman Jeffrey T.
Veik Thomas L.
Zwick Scott D.
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