Electronics cooling subassembly

Details Electronics cooling subassembly Electronics cooling subassembly

H - Electricity

05

K

H05K 7/20 (2006.01)

Patent

CA 2456992

A thermo-electro sub-assembly comprises a gas supply, a first duct, a first heatsink adjacent a first device, a second duct, and a second heat sink adjacent a second device. The first duct provides a passageway for delivering pressurized gas from the gas supply to the first heat sink. The duct may include a plurality of vanes for reducing the turbulence and air boundary separation within the duct. The first heatsink is in thermal communication with a first heat-producing device such as a microprocessor. In a preferred embodiment the heatsink comprises an axial shaped folded fin heatsink. The second duct is used to provide a pathway for the air leaving the first heatsink and delivers the air to the second heatsink. The second duct may also include a plurality of vanes for reducing turbulence and boundary flow separation within the second duct.

L'invention porte sur un sous-ensemble thermoélectrique comportant une source de gaz, un premier conduit, un premier dissipateur contigu au premier conduit et un deuxième conduit et un deuxième dissipateur contigu au deuxième conduit. Le premier conduit, qui constitue un passage amenant le gaz de la source sur le dissipateur, peut comporter plusieurs ailettes réduisant les turbulences et le décollement de la couche limite qui s'y forment. Le premier dissipateur, qui est en communication thermique avec un premier dispositif générateur de chaleur tel qu'un microprocesseur, consiste dans l'exécution préférée en une ailette axiale repliée. Le deuxième conduit, qui constitue un passage amenant le gaz quittant le premier dissipateur sur le deuxième dissipateur peut également comporter plusieurs ailettes réduisant les turbulences et le décollement de la couche limite qui s'y forment.

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