Electronics system with direct engineering change capability

Details Electronics system with direct engineering change capability Electronics system with direct engineering change capability

H - Electricity

01

L

H01L 23/525 (2006.01) H01L 21/48 (2006.01) H01L 23/538 (2006.01)

Patent

CA 2080601

An electronics system and method are provided which allow engineering changes to be made to a substrate without requir- ing the addition of fly wires and without requiring relatively large areas of pads for attaching these wires. Each device site is sur- rounded by a series of engineering change ring patterns (43, 44, 45). A series of engineering change patterns allow change inter- connections between device sites to be made. Fan-in metallizations (60) extend inwardly to the device sites from these change patterns, with a series of vias (63, 69) making surface connections adjacent to the ring patterns. Fan-out metallizations (126) ex- tend from the device site pads to the ring patterns, with a series of vias (210) making surface connections adjacent to the ring pat- terns. Engineering changes are made by directly writing surface metal deposits to make the appropriate connections between the vias and the ring pattern. The original chip pad connections (28, 29) and the new ring pattern (43) connections can be appropri- ately isolated by laser deletions, if necessary.

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