Electroplated blank for coins, medallions and tokens

Details Electroplated blank for coins, medallions and tokens Electroplated blank for coins, medallions and tokens

C - Chemistry, Metallurgy

25

D

40/18, 204/27, 1

C25D 3/58 (2006.01) A44C 21/00 (2006.01) C25D 5/48 (2006.01) C25D 7/00 (2006.01)

Patent

CA 2013639

An electroplated blank capable of having insignia minted on at least one face to form coins, medallions or tokens, the blank having opposed faces and a peripheral side edge and an electroplated coating comprising 0.5 to 4% by weight tin, the balance copper, completely enveloping said blank. The coating forms a thickness of from about 5 µm to about 50 µm on at least said face to be minted.

Flan plaqué par galvanoplastie sur lequel on peut frapper des insignes au moins sur l'une des faces pour former des pièces de monnaie, des médaillons ou des jetons, le flan ayant des faces opposées et une tranche et un placage comprenant de 0,5 à 4 % en poids d'étain et le reste en cuivre enveloppant complètement ledit flan. Le placage a une épaisseur comprise entre environ 5 µm et environ 50 µm sur au moins ladite face à frapper.

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