Electroplating apparatus

Details Electroplating apparatus Electroplating apparatus

C - Chemistry, Metallurgy

25

D

204/122

C25D 17/00 (2006.01) C25D 5/00 (2006.01) C25D 21/00 (2006.01)

Patent

CA 1093012

A B S T R A C T Electroplating apparatus for applying a protective metallic coating on the surface of an object has chamber means which includes a process chamber containing at least a part of the liquid electrolyte solution and in which the object to be seated is submerged. Atmospheric air is prevented from flowing through the process chamber, and a pneumatic pressure-reducing pump is connected to the chamber means to maintain a reduced pressure, which is substantially below atmospheric, above the electrolyte solution within at least a part of the chamber means.

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