Electroplating apparatus for plate-shaped workpieces,...

Details Electroplating apparatus for plate-shaped workpieces,... Electroplating apparatus for plate-shaped workpieces,...

C - Chemistry, Metallurgy

25

D

204/125

C25D 17/00 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1317909

ABSTRACT OF THE DISCLOSURE An apparatus for electroplating plate-shaped workpieces, such as a printed circuit board, having a cell, an arrangement for conducting the workpiece through the cell, and anodes arranged in the cell in contact with the electrolyte solution characterized by an arrangement to cathodically connect the workpiece including at least one tong-shaped contact clamp for gripping the workpiece and an arrangement for moving the clamp along with the workpiece, as it is conveyed through the cell. Preferably, the arrangement for moving is an endless drive of a continuous member, such as a chain or a plurality of belts, and a plurality of contact clamps are spaced along this member to grip the edge portion of the workpieces.

542960

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