C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/129, 204/29,
C25D 3/48 (2006.01) C25D 5/18 (2006.01) C25D 17/28 (2006.01) H05K 3/24 (2006.01)
Patent
CA 1163954
ABSTRACT OF THE DISCLOSURE A metal plating process and apparatus is disclosed and includes a plurality of pre-plating station comprising tanks or reservoirs containing various cleaning and rinsing solutions. A pulse plating or gold flash station including a plating tank is provided after the pre-plating stations, and a plurality of post-plating stations or tanks are pro- vided after the pulse-plating station. Rotatable barrels for containing work loads are carried along path of travel from station to station along the process. Differential speed mechanisms are provided along the process so that the work load containers rotate at a slower rate of rotation while traveling through air than while the containers are disposed within the various tanks or stations along the process. The pulse-plating of the work load at the plating station takes place in a chemical bath while rotating the work load within the bath, while at the same time control- ling the chemistry of the bath including the gold concen- tration, controlling the duty cycle of the pulse-plating operation, controlling the rotation of the work load within the bath, and controlling such other parameters as the bath temperature.
337023
Guio Raphael
Quinton Carroll D.
Allied Corporation
Fetherstonhaugh & Co.
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