Electroplating bath containing palladium amine complex and...

Details Electroplating bath containing palladium amine complex and... Electroplating bath containing palladium amine complex and...

C - Chemistry, Metallurgy

25

D

204/29.5

C25D 3/52 (2006.01)

Patent

CA 1244374

ABSTRACT OF THE DISCLOSURE A high speed ductile palladium electroplating bath cap- able of giving a plating rate of 6 microns per minute and higher. The bath comprises a palladium amine complex salt as a source of the palladium metal, ammonium sulfate, an ammonium halide, an alkali metal pyrophosphate; and a stress reducing agent. The bath may also contain an anionic fluorochemical surfactant to minimize or eliminate any tendency toward pit- ting. The pH of the bath will range from about 7 to 9. Electrolytic deposition will be carried out at a temperature of from about 50 to 80 degrees C at high current densities up to about 3000 ASF. The method of depositing ductile palladium foil on a variety of substrates is also described and claimed.

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