Electroplating device & process

Details Electroplating device & process Electroplating device & process

C - Chemistry, Metallurgy

25

D

C25D 21/18 (2006.01) C25D 17/20 (2006.01)

Patent

CA 2129706

ABSTRACT OF THE DISCLOSURE This invention relates to a process and apparatus for electroplating that has an electrolyte continually circulating through a rotating plating barrel along with its parts to be plated by having an elongated perforated tube that is positioned above the center of a barrel, whereby the barrel is provided with recirculated electrolyte by means of a pump recirculating electrolyte from a plating tank to the elongated perforated tube, which in turn sprays the electrolyte on the parts from above the axis of rotation of the barrel through the perforations while the barrel is rotating, so that the parts are agitated and greater speed and efficiency of the plating process can be achieved.

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