Electroplating from a thiosulfate-containing medium without...

C - Chemistry – Metallurgy – 25 – C

Patent

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96/282, 204/70

C25C 1/20 (2006.01)

Patent

CA 1170615

ABSTRACT OF THE DISCLOSURE The useful life and stability of fixer used in the pro- cessing of film through developer, fixer and wash stages is significantly improved by withdrawing used fixer, electrolytically removing silver therefrom, after stabilizing the withdrawn fixer by adjusting its pH to a substantially constant value and re- circulating thus-treated used fixer for further film processing. Thus the present specification discloses a method for electro- plating a negatively-charged surface by removing metal ions from a thiosulfate-containing medium in contact with the negatively- charged surface and wherein the negatively-charged surface is not completely surrounded by a fluid barrier during electroplating. The specification discloses an improvement which comprises (a) maintaining a voltage of from 0.1 to 2 volts across the medium, (b) maintaining through the medium a current in amperes which is at least equal to, but not more than about twice, the corresponding voltage in volts, (c) maintaining the pH of the medium at a pH of from about 4 to about 5, and (d) agitating the medium without aerating it.

359474

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