C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/24
C25D 15/00 (2006.01) C25D 3/02 (2006.01) C25D 15/02 (2006.01)
Patent
CA 1063966
ELECTROPLATING METHOD ABSTRACT OF THE DISCLOSURE A layer of metal having a plurality of discrete articles of a finely divided solid non-metallic material uniformly dis- persed throughout the metal layer is electrodeposited onto the surface of a substrate metal by first applying an amphoteric surfactant having a substituted imidozolinium structure to the surface of the particles of finely divided non-metallic solid material, or by first introducing the said amphoteric surfactant into the electrolyte solution. The said particles and the said metal are then co-deposited onto the substrate metal from an aqueous acidic electrolyte solution containing metalliferous cations of the said metal in solution and the said particles in suspension therein. Specifically, the amphoteric surfactant employed is selected from the group of substituted imidozolinium derivitives having the chemical structure: ?R:NCH2CH2?(C2H4OR1)(CH2R2) (R3) Where R is a fatty acid radical having from 6 to 18 carbon atoms. R1 is H, Na or CH2COOM R2 is COOM, CH2COOM or CH(OH)CH2SO3M R3 is OH M is H or Na or an organic base
261278
Raymond John L.
Reath Robert Z.
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