Electroplating method

Details Electroplating method Electroplating method

C - Chemistry, Metallurgy

25

D

204/24

C25D 15/00 (2006.01) C25D 15/02 (2006.01)

Patent

CA 1052318

ELECTROPLATING METHOD ABSTRACT OF THE DISCLOSURE A layer of metal having a plurality of discrete particles of a finely divided solid non-metallic material uniformly dis- persed throughout the metal layer is electrodeposited onto the surface of a substrate metal by first applying a tertiary amine oxide surfactant to the surface of the particles of finely divided non-metallic solid material, or by first introducing the said tertiary amine oxide surfactant into the electrolyte solution. The said particles and the said metal are then co-deposited onto the said substrate from an aqueous electrolyte solution contain- ing metaliferous cations of the said metal in solution and the said particles in suspension therein. Specifically, the tertiary amine oxide surfactant employed is selected.from the group having the chemical structure: Image Where R1 is an alkyl, alkene or alkyne radical having from 6 to 22 carbon atoms, R2 is an alkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms, and . . R3 is an alkyl or hydroxyalkyl radical having from 1 to 4 carbon atoms.

261532

Affiliated with

Also associated with

Rating

Electroplating method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-865906