C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/26.5
C25D 3/56 (2006.01) G11B 5/31 (2006.01) H01F 41/26 (2006.01)
Patent
CA 1156964
ELECTROPLATING OF NICKEL-IRON ALLOYS FOR UNIFORMITY OF NICKEL/IRON RATIO USING A LOW DENSITY PLATING CURRENT Abstract The composition gradients associated with the electrodeposition of NiFe over complex topography can be substantially eliminated by using low current density deposition in a region of operation where current density is not a controlling parameter for composition of the deposit. The conditions employed include a plating current density of from 2ma/cm2 to 12ma/cm2 onto objects in a plating bath having a ferrous ion concentration of about 0.15 to 0.3 gm/1 and a nickel ion concentration of about 10 to 14 gm/1. The PH of the system is maintained at about 3, preferably at a temperature of about 20° - 35°C. The ratio of nickel ion to ferrous ion concentration is from about 45 to 1 to 70 to 1. The electrolyte for electrodeposition of approximately 80:20 nickel-iron alloy can include chloride and sulfate metal salts of nickel and iron together with boric acid, sodium saccharin, a wetting agent and sodium chloride. SA9-78-021
339632
Anderson Nathaniel C.
Grover Charles R. Jr.
International Business Machines Corporation
Kerr Alexander
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