Electroplating of copper from alkanesulfonate electrolytes

Details Electroplating of copper from alkanesulfonate electrolytes Electroplating of copper from alkanesulfonate electrolytes

C - Chemistry, Metallurgy

25

D

C25D 3/38 (2006.01) C25D 5/02 (2006.01) C25D 7/12 (2006.01)

Patent

CA 2322726

Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic acids and which is intended for the metallization of micron or submicron dimensioned trenches or vias.

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