Electroplating of gold

Details Electroplating of gold Electroplating of gold

C - Chemistry, Metallurgy

01

G

23/105, 204/29

C01G 7/00 (2006.01) C01B 21/50 (2006.01) C25D 3/48 (2006.01)

Patent

CA 1036321

ABSTRACT OF THE DISCLOSURE This invention relates to the electroplating of gold using a gold complex which is prepared by reacting an alkali metal gold sulphite with a complexing salt which is an alkali metal nitrite. The complex has the empirical formula M4AuNO8S2 where M is the alkali metal preferably sodium. A gold electroplating bath is also described consisting of the complex together with an alkali metal nitrite.

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